JINGXIN is a professional manufacturer of PCB & PCBA and EMS (electronics manufacturing service) with nearly 15-year experience in PCB Design & Layout, PCB Fabrication, PCB Assembly, PCBA Prototype, PCBA Test, Electronic Part Sourcing and EMS for kinds of smart electronic manufacturing.
SMT Processing
Now we have 20 SMT Lines and 8 DIP Lines to perform PCB assembly. The precision of chip replacement is up to +0.1MM, this indicates we have professional skills in producing all kinds of printed integrated circuit boards such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA with surface-mount technology (SMT), thru-hole technology (THT) and merged tech components.
DIP Processing
JINGXIN has 8 DIP processing lines, professional working platforms and carriers, this ensures a output capacity of 1 500 000pcs per day. For every process, technical and standard operation guidelines are made to follow, with strict KPI, this makes sure of 99.8% of pass for every PCBA. Lower our rejects, create more value for clients.
PCB Design & Layout
» Excellent Expertise in design tools: Allegro, Pads, and Mentor Expedition. » High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…) » Flex PCB designs of all sorts » Complete assembly drawings » In-Circuit Test data generation (ICT) » Drill, panel and cutout drawings designed » Professional fabrication documents created » High-speed, multi-layer digital PCB designs- Bus routing, differential pairs, matched lengths; Fast PCB design in 2-3 days. » Concentrate on the PCB design Wi-Fi Module, BLE Module, GPS Tracking application.RF Modules,Medical-Care devices,LED PCB Boards. » We come up with the design as per customer requirement,and take care for the RAW material cost at the outset of design. » Full control for the PCB design, from requirement, Schematic, PCB Layout, SI/PI/EMI inspection, we will locate the design issues in the inspection processing.
PCB Fabrication Center
We have produced all kinds of PCBs including FR4, FR1, CEM1, FPC, Metal Core PCB and Rogers PCB, etc. With the advantage of material and component sourcing channels, we have the ability of fast PCB sample--48 hours after order confirmation.
PCB Specifications
| PCB layer | 1, 2, 4 or 6, up to 18 layers |
| Board shape | Rectangular, round, slots, cutouts, complex, irregular |
| Board type | Rigid, flexible, rigid-flexible |
| Board material | FR-4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc. |
| Board cutting | Shear, V-score, tab-routed |
| Board thickness | 0.2 ~ 4.0 mm (±10%), Flex board: 0.01 ~ 0.25″ (±10%) |
| Copper weight | 1.0, 1.5, 2.0 Oz (tolerance ±0.25 oz) |
| Solder mask | Double-sided green LPI, Also support red, white, yellow, blue, black |
| Silk screen | Double-sided or single-sided in white,yellow, black, or negative |
| Silk screen min. line width | 0.006″ or 0.15mm |
| Max board dimension | 20 inch *20 inch or 500mm*500mm |
| Min. trace/gap | 0.10mm, or 4 mils |
| Min. drill hole diameter | 0.01”, 0.25mm, or 10 mils |
| Surface finish | HASL, Nickle, Imm Gold, Imm Tin, Imm Silver, OSP etc. |
| Min.slot width | 0.12”, 3.0 mm, or 120 mils |
| V-score depth | 20-25% of board thickness |
| Plated through holes | Yes |
| Design file format | Gerber RS274X, 274D, Eagle and AutoCAD’s, DXF, DWG, Protel 99se |
Supported Assembly Capabilities
Different types of Assembly
°THD (Thru-Hole Device)
°SMT (Surface-Mount Technology)
°SMT & THD combined
°2-sided SMT and THD assembly
Order Volume Allowed
°1 to 5,000 boards
Parts
°Passives parts, smallest size 0201
°Fine pitch to 8 Mils
°BGA, uBGA, QFN, POP and Zero-Lead chips
°Connectors and terminals
Component Package
°Reels
°Cut tape
°Tube and tray
°Loose parts and bulk
PCB Board Measurements
°Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
°Largest dimension: 15″ x 20″ (381mm x 508mm)
Printed circuit board shapes
°Oblong
°Round
°Slots and Cut outs
°Complicated and Uncommon
PCB board kinds
°Rigid FR-4 boards
°Rigid-Flex boards
Assy procedures
°Leaded process
°Zero-Lead (RoHS)
Design file formatting
°Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
°BOM (Bill of Materials) (.xls, .csv, . xlsx)
°Centroid (Pick-N-Place Or XY file)
Testing Processes
°Visual Inspection
°X-ray Inspection
°AOI (Also known as: Automated Optical Inspection)
°ICT (AKA: In-Circuit Test)
°Functional testing
Turnaround time periods
°1 To 5 days for only printed circuit board assy
°10 To16 days for full Turnkey Circuit Card Assy
Turnkey PCB Board Assembly Solutions
•Rapid Turnaround •Prototype/Production Support •Blank Boards»Components»Assembly •Rapid On-line Quote
